Laser scribing
 




SCRIBING

Accurate and reliable scribing to customer specifications

Laser-scribed substrates are normally supplied without tooling or computer part program costs.

  1. depth of scribing normally 30 - 50% of material thickness (or by arrangement)
  2. laser pulse spacing normally 0.15+/-0.02 mm centreline to centreline (or by arrangement)
  3. edge to design. Border edge to be snapped off should be at least 5 times material thickness
  4. length and width between scribed edges +0.15/-0.05mm
  5. laser-scribed/laser-profiled edge to first scribe line +0.15/-0.05 mm
  6. scribe line to scribe line +/- 0.05 mm

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